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2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Taipei, Taiwan Oct 20, 2021 - Oct 22, 2021 Abstract Submission Date: Jun 18, 2021 2021 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS) Tel Aviv, Israel Nov 1, 2021 - Nov 3, 2021 Abstract Submission Date: May 3, 2021

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Semiconductor IC Packaging, Design Test Services

Abstract: The pace of technical innovation in semiconductor packaging continues to accelerate forward at remarkable rates. While the latest wave of technology advancements is largely due to product needs in artificial intelligence (AI),

Virtual ISS 2021 Presentation Abstract

Semiconductor content is growing across all major markets. As we look forward there are some exciting technologies that begin to ramp over the coming years, including 5G, WiFi 6, AI inferencing, NAND, advanced process technologies and packaging, and optimized computing at the edge that will drive a sustainable recovery for the industry.

Implementation Of A Fully Molded Fan

November 2013 Boyd Rogers, Ph.D. Vice President of RD, Deca Technologies Abstract: Fan-Out Wafer-Level Packaging (FOWLP) is finally beginning to gain traction as a means of packaging semiconductor chips with interconnect densities exceeding the capabilities of standard Wafer Level Chip Scale Packaging (WLCSP). However, despite its promise, widespread adoption of FOWLP has been

MOSFET Basics, Working Principle and Applications

The author perfected this article on Jan 17, 2020 Abstract As MOSFET is widely used today, it is necessary to comprehend how does MOSFET work and its basic knowledge. Metal oxide semiconductor field effect transistor (MOSFET) is a field-effect transistor (FET) that can be widely used in analog and digital circuits.

Power Technology Roadmap Forum

2018/12/20Abstract: This presentation will first focus on the challenges associated with the packaging of Wide Bandgap semiconductors. The presentation will address, electromagnetic limitations and a 3-D integration concept for a simple switching cell in both SiC and GaN applications.

MOSFET Basics, Working Principle and Applications

The author perfected this article on Jan 17, 2020 Abstract As MOSFET is widely used today, it is necessary to comprehend how does MOSFET work and its basic knowledge. Metal oxide semiconductor field effect transistor (MOSFET) is a field-effect transistor (FET) that can be widely used in analog and digital circuits.

3D Packaging is transforming the world of

3D Packaging plays a pivotal role to re-invent integration architectures Although Moore's Law has remained alive for over five decades, it is no longer cost-efficient. When it comes to advanced lithographic nodes, lesser manufacturers can keep up. Now there are only three leading-edge players, Intel, Samsung and TSMC. The industry is now diligently using advanced

The latest trend news in the Semiconductor Industry

Semiconductor industry: it is imperative to innovate. Advanced packaging is the path forward May 18-20, 2021 | Online Leading players must act fast and play on their strengths to innovate and compete. And advanced packaging could most certainly be a pivotal approach. Advanced packaging has become essential for semiconductor innovation. Advanced packaging platforms allow this

Laminar Metal Foam: A Soft and Highly Thermally

Future electronic packaging technology requires semiconductor chips having a larger size and higher power for advanced applications, e.g., new energy conversion systems, electric vehicles, and data center servers, yet traditional thermal interface materials (TIMs) with a high thermal conductivity are generally stiff materials with weak joints, which cause the accumulated thermal stress to

Liquid dispensing encapsulation in semiconductor

Liquid encapsulation techniques have been used extensively in advanced semiconductor packaging, including applications of underfilling, cavity‐filling, and glob top encapsulation. Because of the advanced encapsulation materials and the automatic liquid dispensing

The latest trend news in the Semiconductor Industry

One year has passed since the latest successful edition. NCAP and Yole Dveloppement are now back with an exciting 2020 program for you in Wuxi, China, this year.As of, the agenda will be a powerful mix of key sessions related to the industry evolution and technical innovations and effective network times for people who will get the chance to join us on-site.

The latest trend news in the Semiconductor Industry

Semiconductor industry: it is imperative to innovate. Advanced packaging is the path forward May 18-20, 2021 | Online Leading players must act fast and play on their strengths to innovate and compete. And advanced packaging could most certainly be a pivotal approach. Advanced packaging has become essential for semiconductor innovation. Advanced packaging platforms allow this

Semiconductor IC Packaging, Design Test Services

Abstract: The pace of technical innovation in semiconductor packaging continues to accelerate forward at remarkable rates. While the latest wave of technology advancements is largely due to product needs in artificial intelligence (AI),

CSTIC (China Semiconductor Technology International

CSTIC 2021 is one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. Organized by SEMI, IMEC and IEEE-EDS, co-organized by IMECAS. CSTIC 2021 will be held on March 14-15, 2021 in

MOSFET Basics, Working Principle and Applications

The author perfected this article on Jan 17, 2020 Abstract As MOSFET is widely used today, it is necessary to comprehend how does MOSFET work and its basic knowledge. Metal oxide semiconductor field effect transistor (MOSFET) is a field-effect transistor (FET) that can be widely used in analog and digital circuits.

Backside Metallization for Low Cost High Thermal Package

Abstract Advanced semiconductor packaging requirements for higher and faster performance in a thinner and smaller form factor with significantly higher thermal dissipation continue to be the driver for mining and artificial intelligence (AI)/high performance

The latest trend news in the Semiconductor Industry

One year has passed since the latest successful edition. NCAP and Yole Dveloppement are now back with an exciting 2020 program for you in Wuxi, China, this year.As of, the agenda will be a powerful mix of key sessions related to the industry evolution and technical innovations and effective network times for people who will get the chance to join us on-site.

2018 Semiconductor Packaging News Is Fully Automatic Bond

1 2018 Semiconductor Packaging News Is Fully Automatic Bond Testing Possible? Bob Sykes, Cor van Mil, Tom Haley, Clyde Chen, Herbert Stuermann, Volker Loibl XYZTEC bv 5981XC Panningen, Netherlands. salesxyztec Abstract Advances in bond

Semiconductor IC Packaging, Design Test Services

Gopi Boinepally, Sr. Director- Power Products at Amkor Technology, will be presenting "Technology Trends and Challenges in Power Semiconductor Packaging" Abstract: The power semiconductors market is at least seven decades-old with products supporting numerous applications in consumer, industrial and automotive segments.

ECTC Abstract Submission Deadline is October 8

Semiconductor Packaging News - Exclusive: ECTC Abstract Submission Deadline is October 8 Press Release - ECTC September 17, 2018 ECTC Abstract Submission Deadline is October 8 Call for Papers is now open for the 2019 IEEE Electronic Components

Aluminum

A well-known aluminum-scandium (Al-Sc) alloy, already used in lightweight sports equipment, is about to be established for use in electronic packaging. One application for Al-Sc alloy is manufacture of bonding wires. The special feature of the alloy is its ability to harden by precipitation. The new bonding wires with electrical conductivity similar to pure Al wires can be processed on common

Technology Week Webinar Series

Day 1 - Power Electronics and Devices Day Empowering Electrification in the New Digital World Add to Calendar 2021-03-23 14:30:00 2021-03-25 17:00:00 Technology Week Webinar Series Technology Week Webinar Series Technology Week Webinar Series has successfully concluded - REGISTER and access the presentations ON-DEMAND available until June 30, 2021.

Packaging Challenges in a World Driven by the Internet

Packaging Challenges in a World Driven by the Internet of Things and Migration to the Cloud Abstract The semiconductor industry growth was driven first by government requirements with mainframe computing as the primary platform, the second phase of growth came from desktop computers for both business and consumer applications.

Semiconductor Market Research Reports

Abstract: - Global Semiconductor Packaging Market to Reach $41.8 Billion by 2027 - Amid the COVID-19 crisis, the global market for Semiconductor Packaging estimated at US$26.7 Billion in the year 2020, is projected to reach a revised size of US$41.8 Billion

Global Semiconductor Advanced Packaging Industry

Abstract: - Global Semiconductor Advanced Packaging Market to Reach $44.2 Billion by 2027 - Amid the COVID-19 crisis, the global market for Semiconductor Advanced Packaging estimated at US$32 Billion in the year 2020, is projected to reach a revised size of US$44.2 Billion by 2027, growing at a CAGR of 4.7% over the analysis period 2020-2027.

Power Technology Roadmap Forum

2018/12/20Abstract: This presentation will first focus on the challenges associated with the packaging of Wide Bandgap semiconductors. The presentation will address, electromagnetic limitations and a 3-D integration concept for a simple switching cell in both SiC and GaN applications.

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